The TEPI Patch technology utilises a pressure-sensitive adhesive developed by Bostik. The superior adhesion of TEPI Patches means that it remains in contact with the skin throughout the dosing period so the full dose is delivered. A range of TEPI Patch products have been shown in a standard lab test to have better adhesion than commercial products tested (see figure below).
The rate of drug release from the TEPI Patch can be tailored to meet the desired pharmacokinetic profile for the patients being treated by adjusting the excipients included in the formulation (see figure below). Due to the higher loading capacity of the adhesive, a wider range of excipients can be included. The high drug loading also means that less adhesive is needed to formulate the therapeutic dose so patches can be thinner and smaller.
Unlike other patch adhesives, no organic solvents are used in the manufacture of the TEPI Patch, so there is no need for a costly solvent removal step and less drug is needed. Drugs dissolve directly in the pre-cured adhesive which is then cured with water vapour. The manufacturing process is straightforward and environmentally friendly.